Samsung presented its CIS news at Image Sensor Forum in Shenzhen, China on Sept. 22, 2014. About the only thing available in open access is an impressive alphabetical list of phones with Samsung sensors inside:
· DOOV S2
· Gionee ELife E3
· Gionee Elife E5
· HTC Desire 816
· HTC One M8
· Huaqin
· Huawei Ascend G6
· Huawei Honor 3C
· Huawei Honor 6
· KONKA I158
· KONKA W450
· KONKA W550
· Lenovo Vibe Z2 Pro
· Loncheer
· Nokia X
· Oppo R601
· Samsung Galaxy S5
· Sony Experia E3
· TCL EOS
· TCL Soul 4
· TCL Alto 4.5
· Vivo X3
· Vivo Xplay 3S
· Wintech
· Xiaomi Mi 2S
· Xiaomi Redmi LTE
· Xiaomi Redmi Note
· Xiaomi Redmi Note 4G LTE
· ZTE Grand 2
2013 Leti Annual Report
2013 Leti annual report has a collection of the last year's papers. The "New 3D-integrated burst image sensor architectures with in-situ A/D conversion" by R. Bonnard, F. Guellec, J. Segura, A. Dupret, and W. Uhring, presented at 2013 Conference on Design and Architectures for Signal and Image Processing (DASIP) shows the 3D imager with clusters of pixels sharing a readout and an ADC:
Keysight Explains MIPI C-PHY Signalling
Keysight (formerly known as Agilent) presents a short explanation of how the new MIPI C-PHY scheme works. The webinar with the explanations can be accessed here.
CIS Stacking at Image Sensors Americas Conference
3DInCites publishes a review of Image Sensor Americas presentations on stacked image sensors. "Stacked chip image sensors require high volume manufacturing (HVM) to be cost-effective, explained [Piet] De Moor [IMEC], because of the cost of the manufacturing equipment lines. Because of this, to date stacked BSI CIS are only manufactured by Sony and TSMC (for OmniVision) targeting consumer products, where the volume requirements are higher."
Two pictures form the article:
Two pictures form the article:
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| From Sony ISSCC 2013 paper |
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| Ziptronix Cost Comparison |
Chipworks iPhone 6 Plus Teardown Finds Sony Sensors in Front and Rear Cameras
Chipworks is quick to publish reverse engineering pictures of iPhone 6 and 6 plus: "The iPhone 6 Plus iSight camera chip is housed in a camera module measuring 10.6 mm x 9.3 mm x 5.6 mm thick. Fabricated by Sony, the iSight camera chip is a stacked (Exmor RS), back-illuminated CMOS image sensor (CIS) featuring 1.5 µm generation pixels (introduced for the iPhone 5s). The die size is 4.8 mm x 6.1 mm (29.3 mm2). The phase pixel pairs have all been implemented in the green channel and cover the majority of the active pixel array."
"Our speculation of Sony winning the FaceTime sockets, though, turned out to be correct. We’ve just confirmed the iPhone 6 Plus FaceTime camera is a stacked Sony CIS and will provide more details in a future update."
Chipworks publishes few pictures of iPhone 6 Plus rear camera:
"Our speculation of Sony winning the FaceTime sockets, though, turned out to be correct. We’ve just confirmed the iPhone 6 Plus FaceTime camera is a stacked Sony CIS and will provide more details in a future update."
Chipworks publishes few pictures of iPhone 6 Plus rear camera:
Sony Announces SmartEyeglass
Sony releases a development prototype of SmartEyeglass, a Google Glass competitor. The SmartEyeglass is equipped with a 3MP camera, capable of VGA video. A high capacity battery is located in a separate controller box connected to the glasses by a wire:
Sony plans to offer SmartEyeglass for sale to developers by the end of FY2014 (March 2015), with the intention of further promoting the development of applications and accelerating the commercialization of the product for consumer use. A Youtube video shows the prototype glasses in action:
Sony plans to offer SmartEyeglass for sale to developers by the end of FY2014 (March 2015), with the intention of further promoting the development of applications and accelerating the commercialization of the product for consumer use. A Youtube video shows the prototype glasses in action:
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